HT6P12 Ver la hoja de datos (PDF) - Holtek Semiconductor

Número de pieza

componentes Descripción

Fabricante

HT6P12

Learning Car Alarm Decoder

Holtek Semiconductor 

Pad Assignment

HT6P12

Chip size: 2580 × 2580 (µm)2

* The IC substrate should be connected to VSS in the PCB layout artwork.

* The T4 pad must be bonded to VDD or VSS.

* Other test pad (T1~T3, T5~T9) must be floating.

3

2nd Oct ’97

Share Link: