HT2860 Ver la hoja de datos (PDF) - Holtek Semiconductor
Número de pieza
componentes Descripción
Fabricante
HT2860 Datasheet PDF : 9 Pages
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Pad Coordinates
HT2860
Unit: mil
Pad
No.
1
2
3
4
5
6
7
8
9
X
Y
–38.21 39.10
–38.21 30.60
–38.21 –22.44
–38.21 –39.10
–25.71 –39.10
–13.56 –39.10
10.75 –39.10
22.91 –39.10
38.38 –39.10
Pad
No.
10
11
12
13
14
15
16
17
18
X
38.38
38.38
38.38
38.38
30.14
–2.68
–10.75
–18.83
–26.90
Y
6.38
18.10
29.84
39.10
39.10
39.10
39.10
39.10
39.10
Chip size: 89 × 90 (mil)2
∗ The IC substrate should be connected to VDD in the PCB layout artwork.
Block Diagram
2
11th July ’97
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