HT46C46E Ver la hoja de datos (PDF) - Holtek Semiconductor
Número de pieza
componentes Descripción
Fabricante
HT46C46E Datasheet PDF : 73 Pages
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HT46R46E/C46E/R47E/C47E/R48AE/C48AE/R49E
Pin Name
PD0/PWM0
PD1/PWM1
OSC1
OSC2
RES
VDD
VSS
I/O
Configuration
Option
Description
Bidirectional 2-bit input/output port. Software instructions determine if the pin
I/O
Pull-high
I/O or PWM
is a CMOS output or Schmitt Trigger input. Configuration option determines if
this pin has a pull-high resistor. The PWM output are pin-shared with pins
PD0 and PD1 selected via a configuration option.
OSC1, OSC2 are connected to an external RC network or external crystal,
I
O
Crystal or RC
determined by configuration option, for the internal system clock. If the RC
system clock option is selected, pin OSC2 can be used to measure the sys-
tem clock at 1/4 frequency.
I
¾
Schmitt Trigger reset input. Active low.
¾
¾
Positive power supply
¾
¾
Negative power supply, ground
Note:
1. Each pin on PA can be programmed through a configuration option to have a wake-up function.
2. Individual pins can be selected to have a pull-high resistor.
3. Pins PC2~PC4 and pin PD1/PWM1 exist but are not bonded out on the 24-pin package.
4. Unbonded pins should be setup as outputs or as inputs with pull-high resistors to conserve power.
Absolute Maximum Ratings
Supply Voltage ...........................VSS-0.3V to VSS+6.0V
Input Voltage..............................VSS-0.3V to VDD+0.3V
IOL Total ..............................................................150mA
Total Power Dissipation .....................................500mW
Storage Temperature ............................-50°C to 125°C
Operating Temperature...........................-40°C to 85°C
IOH Total............................................................-100mA
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
D.C. Characteristics
Symbol
Parameter
VDD
Operating Voltage
IDD1
Operating Current (Crystal OSC)
IDD2
IDD3
ISTB1
Operating Current (RC OSC)
Operating Current
(Crystal OSC, RC OSC)
Standby Current (WDT Enabled)
ISTB2
VIL1
VIH1
VIL2
Standby Current (WDT Disabled)
Input Low Voltage for I/O Ports,
TMR and INT
Input High Voltage for I/O Ports,
TMR and INT
Input Low Voltage (RES)
Test Conditions
VDD
Conditions
¾ fSYS=4MHz
¾ fSYS=8MHz
3V No load, fSYS=4MHz
5V ADC disable
3V No load, fSYS=4MHz
5V ADC disable
5V
No load, fSYS=8MHz
ADC disable
3V No load,
5V system HALT
3V No load,
5V system HALT
¾
¾
Min.
2.2
3.3
¾
¾
¾
¾
¾
¾
¾
¾
¾
0
Ta=25°C
Typ. Max. Unit
¾
5.5
V
¾
5.5
V
0.6
1.5
mA
2
4
mA
0.8
1.5
mA
2.5
4
mA
4
8
mA
¾
5
mA
¾
10
mA
¾
1
mA
¾
2
mA
¾ 0.3VDD V
¾
¾
0.7VDD ¾
VDD
V
¾
¾
0
¾ 0.4VDD V
Rev. 1.20
5
August 15, 2007
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