HSMB-A100 Ver la hoja de datos (PDF) - HP => Agilent Technologies
Número de pieza
componentes Descripción
Fabricante
HSMB-A100 Datasheet PDF : 13 Pages
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0.5
0.4
0.3
0.2
0.1
0
GaP/AlGaAs/
AlInGaP
-0.1
-0.2
-0.3
-100 -50
InGaN/GaN
0
50 100 150
TEMPERATURE – °C
Figure 6. Forward voltage shift vs. temperature.
20 SEC. MAX.
240°C MAX.
3°C/SEC. MAX.
100-150°C
183°C
3°C/SEC.
MAX.
120 SEC. MAX. 60-150 SEC.
TIME
–6°C/SEC.
MAX.
Figure 8a. Recommended SnPb reflow soldering profile.
1.0
0.8
0.6
0.4
0.2
0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGULAR DISPLACEMENT – DEGREES
Figure 7. Radiation Pattern.
217 °C
255
°C
+5
-0
°C
°C
3 °C/SEC. MAX.
125 °C ± 25 °C
MAX. 120 SEC.
10 to 20 SEC.
6 °C/SEC. MAX.
60 to 150 SEC.
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 8b. Recommended Pb-free reflow soldering profile.
4.50
1.50
TURBULENT WAVE
250
LAMINAR WAVE
HOT AIR KNIFE
2.60
200
150
FLUXING
100
50
30
PREHEAT
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
0 10 20 30 40 50 60 70 80 90 100
TIME – SECONDS
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
;; ;; SOLDERWAVETEMPERATURE=245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
;;;; ;;; BEFOREEXERTINGMECHANICALFORCE.
SOLDER RESIST
Figure 9. Recommended wave soldering profile.
Figure 10. Recommended soldering pad pattern.
9
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