HSDL-3209 Ver la hoja de datos (PDF) - HP => Agilent Technologies

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componentes Descripción

Fabricante

HSDL-3209

Infrared IrDA Compliant Transceiver

HP => Agilent Technologies 

1.2 Recommended Metal Solder

Stencil Aperture

It is recommended that only a

0.152 mm (0.006 inches) or a

0.127 mm (0.005 inches) thick

stencil be used for solder

paste printing. This is to

ensure adequate printed solder

paste volume and no shorting.

See the table below the

drawing for combinations of

metal stencil aperture and

metal stencil thickness that

should be used.

Aperture opening for shield

pad is 2.7 mm x 1.25 mm as

per land pattern.

Apertures as

per land

Dimensions

l

Stencil Thickness, t (mm)

0.152 mm

0.127 mm

t

w

Aperture size (mm)

Length, l (mm) Width, w (mm)

2.60 ± 0.05

0.55 ± 0.05

3.00 ± 0.05

0.55 ± 0.05

1.3 Adjacent Land Keepout and

Solder Mask Areas

Adjacent land keep-out is the

maximum space occupied by

the unit relative to the land

pattern. There should be no

other SMD components within

this area. The minimum solder

resist strip width required to

avoid solder bridging adjacent

pads is 0.2 mm. It is

recommended that two fiducial

crosses be place at midlength

of the pads for unit alignment.

Note: Wet/Liquid Photo-

Imageable solder resist/mask is

recommended.

7.2

0.2

Solder mask

2.6

3.0

Units: mm

11

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