HM-6504/883 Ver la hoja de datos (PDF) - Intersil

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componentes Descripción

Fabricante

HM-6504/883

4096 x 1 CMOS RAM

Intersil 

Die Characteristics

DIE DIMENSIONS:

136 x 169 x 19 ±1mils

METALLIZATION:

Type: Si - Al

Thickness: 11kÅ ±2kÅ

GLASSIVATION:

Type: SiO2

Thickness: 8kÅ ±1kÅ

Metallization Mask Layout

A2

A3

HM-6504/883

WORST CASE CURRENT DENSITY:

1.79 x 105 A/cm2

LEAD TEMPERATURE (10s soldering):

≤ 300oC

HM-6504/883

A1

A0

VCC

A6

A7

A8

A4

A9

A10

A5

A11

Q

W GND E D

NOTE:

1. Pin numbers correspond to DIP Package only.

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate

and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which

may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site http://www.intersil.com

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