HMC327MS8GE(V04) Ver la hoja de datos (PDF) - Hittite Microwave
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Fabricante
HMC327MS8GE Datasheet PDF : 6 Pages
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Evaluation PCB
v04.0607
HMC327MS8G / 327MS8GE
GaAs InGaP HBT MMIC
POWER AMPLIFIER, 3.0 - 4.0 GHz
5
List of Materials for Evaluation PCB 104991 [1]
Item
J1 - J2
J3
C1 - C3
C4
C5
C6
L1
R1
U1
Description
PCB Mount SMA RF Connector
2 mm DC Header
330 pF Capacitor, 0603 Pkg.
1.2 pF Capacitor, 0603 Pkg.
2.0 pF Capacitor, 0402 Pkg.
2.2 μF Capacitor, Tantalum
3.0 nH Inductor, 0805 Pkg.
130 Ohm Resistor, 0603 Pkg.
HMC327MS8G / HMC327MS8GE Amplifier
The circuit board used in the final application should
use RF circuit design techniques. Signal lines
should have 50 ohm impedance while the package
ground leads and exposed paddle should be con-
nected directly to the ground plane similar to that
shown. A sufficient number of via holes should be
used to connect the top and bottom ground planes.
The evaluation board should be mounted to an
appropriate heat sink. The evaluation circuit board
shown is available from Hittite upon request.
PCB [2]
104829 Eval Board
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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