HMC323(V00) Ver la hoja de datos (PDF) - Hittite Microwave
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Fabricante
HMC323 Datasheet PDF : 6 Pages
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MICROWAVE CORPORATION
HBT DRIVER AMPLIFIER DC - 3.0 GHz
FEBRUARY 2001
Evaluation PCB for HMC323
HMC323
V00.1100
1
The circuit board used in the final application should use RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the
ground plane similar to that shown above. A sufficient number of VIA holes should be used to connect the top
and bottom ground planes. The evaluation circuit board as shown is available from Hittite upon request.
Evaluation Circuit Board Layout Design Details
Item
J1 - J2
U1
PCB*
Description
PC Mount SMA Connector
HMC323
104196 Evaluation PCB 1.5" x 1.5"
*Circuit Board Material: Rogers 4350
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343
1 - 154
Fax: 978-250-3373
Web Site: www.hittite.com
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