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HMC-ALH459 Ver la hoja de datos (PDF) - Hittite Microwave

Número de pieza
componentes Descripción
Fabricante
HMC-ALH459
Hittite
Hittite Microwave Hittite
HMC-ALH459 Datasheet PDF : 6 Pages
1 2 3 4 5 6
v01.1207
1
Absolute Maximum Ratings
Drain Bias Voltage
Gate Bias Voltage
RF Input Power
Thermal Resistance
(channel to die bottom)
Storage Temperature
Operating Temperature
+3 Vdc
-1 to +0.3 Vdc
-5 dBm
195.6 °C/W
-65 to +150 °C
-55 to +85 °C
Outline Drawing
HMC-ALH459
GaAs HEMT LOW NOISE
AMPLIFIER, 71 - 86 GHz
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Die Packaging Information [1]
Standard
Alternate
WP - 19
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BACKSIDE METALLIZATION: GOLD.
4. BACKSIDE METAL IS GROUND.
5. BOND PAD METALLIZATION: GOLD.
6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
7. OVERALL DIE SIZE ±.002”
1-4
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com

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