HMC-ALH140 Ver la hoja de datos (PDF) - Hittite Microwave
Número de pieza
componentes Descripción
Fabricante
HMC-ALH140 Datasheet PDF : 3 Pages
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v00.0907
Absolute Maximum Ratings
Drain Bias Voltage
Gate Bias Voltage
RF Input Power
Channel Temperature
Storage Temperature
+5.5 Vdc
-1 to +0.3 Vdc
6 dBm
180 °C
-65 to +150 °C
Outline Drawing
HMC-ALH140
GaAs HEMT MMIC LOW NOISE
AMPLIFIER, 24 - 40 GHz
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BACKSIDE METALLIZATION: GOLD.
4. BACKSIDE METAL IS GROUND.
5. BOND PAD METALLIZATION: GOLD.
6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
7. OVERALL DIE SIZE ±.002”
0-4
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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