HMBT468 Ver la hoja de datos (PDF) - Hi-Sincerity Mocroelectronics
Número de pieza
componentes Descripción
Fabricante
HMBT468 Datasheet PDF : 5 Pages
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HI-SINCERITY
MICROELECTRONICS CORP.
Temperature Profile for Dip Soldering
300
10+/-2 sec
250
200
150
100
120+/-20 sec
50
0
0
50
100 150 200 250 300 350
Time(sec)
Spec. No. : HN200204
Issued Date : 2001.07.01
Revised Date : 2004.09.08
Page No. : 3/5
HMBT468
HSMC Product Specification
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