HLMP-C115-X0000 Ver la hoja de datos (PDF) - HP => Agilent Technologies
Número de pieza
componentes Descripción
Fabricante
HLMP-C115-X0000 Datasheet PDF : 10 Pages
| |||
Package Dimensions
8.71 ± 0.20
(0.343 ± 0.008)
5.00
(0.197
±
±
0.20 (NOTE
0.008)
1)
1.14 ± 0.20
(0.045 ± 0.008)
31.60
(1.244)
MIN.
CATHODE
LEAD
1.85 (0.073)
MAX.
0.70 (0.028)
MAX.
1.00 MIN.
(0.039)
0.50
(0.020
±
±
0.10
0.004)
SQ.
TYP.
CATHODE
FLAT
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. LEADS ARE MILD STEEL, SOLDER DIPPED.
3. AN EPOXY MENISCUS MAY EXTEND ABOUT
0.5 mm (0.020 in.) DOWN THE LEADS.
HLMP-Cx15 and HLMP-Cx23
12.60 ± 0.18
(0.496 ± 0.007)
(311.2.6404)MIN.
CATHODE
LEAD
5.00 ± 0.20
(0.197 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
1.50 ± 0.15
(0.059 ± 0.006)
0.70 (0.028)
MAX.
1.00 MIN.
(0.039)
CATHODE
FLAT
0.50
(0.020
±
±
00..10004)SQ.
TYP.
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
HLMP-Cx17
Absolute Maximum Ratings at TA = 25°C
Parameter
DC Forward Current[1]
Transient Forward Current[2]
(10 µsec Pulse)
Reverse Voltage (Ir = 100 µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Wave Soldering Temperature
[1.59 mm (0.063 in.) from body]
Lead Solder Dipping Temperature
[1.59 mm (0.063 in.) from body]
DH AS
AlGaAs
Red
30
500
5
110
–20 to +100
High
Efficiency
Red and
Orange
30
500
Yellow
20
500
5
5
110
110
–55 to +100
–55 to +100
250°C for 3 seconds
260°C for 5 seconds
High
Performance
Green and
Emerald Green
30
500
5
110
–20 to +100
Units
mA
mA
V
°C
°C
°C
Notes:
1. See Figure 5 for maximum current derating vs. ambient temperature.
2. The transient current is the maximum nonrecurring peak current the device can withstand without damaging the LED die and wire bond.
4
Share Link: 