HI-8444 Ver la hoja de datos (PDF) - Holt Integrated Circuits
Número de pieza
componentes Descripción
Fabricante
HI-8444 Datasheet PDF : 9 Pages
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HI-8444, HI-8445, HI-8448 PACKAGE DIMENSIONS
38-PIN PLASTIC TSSOP
inches (millimeters)
Package Type: 38HS
.252 ± .006
(6.400 ± .150)
.382 ± .004
(9.700 ± .100)
Pin 1
.173 ± .004
(4.400 ± .100)
.0085 ± .0025
(.22 ± .05)
.006 ± .002
(.145 ± .055)
See Detail A
.036 ± .005
(.925 ± .125)
.020
(.50)
BSC
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
0° to 8°
.018 - .029
(.450 - .750)
.004 ± .002
(.100 ± .050)
Detail A
44-PIN PLASTIC CHIP-SCALE PACKAGE (QFN)
.276
(7.00)
BSC
.276
(7.00)
BSC
Top View
.203 ± .006
(5.15 ± .15)
inches (millimeters)
Package Type: 44PCS
.203 ± .006
(5.15 ± .15)
Bottom
View
.020
(0.50)
BSC
.010
(0.25)
typ
.039
(1.00)
max
.008
(0.2)
typ
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
.016 ± .002
(0.40 ± .05)
HOLT INTEGRATED CIRCUITS
9
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