HI-1570 Ver la hoja de datos (PDF) - Holt Integrated Circuits
Número de pieza
componentes Descripción
Fabricante
HI-1570 Datasheet PDF : 11 Pages
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PACKAGE DIMENSIONS
44-PIN PLASTIC CHIP-SCALE PACKAGE
.276
(7.00)
BSC
.276
(7.00)
BSC
Top View
.203 ± .006
(5.15 ± .15)
inches (millimeters)
Package Type: 44PCS
.203 ± .006
(5.15 ± .15)
Bottom
View
.020
(0.50)
BSC
.010
(0.25)
typ
.039
(1.00)
max
.008
(0.2)
typ
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
.016 ± .002
(0.40 ± .05)
HOLT INTEGRATED CIRCUITS
11
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