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HEF40175BT,652 Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza
componentes Descripción
Fabricante
HEF40175BT,652
NXP
NXP Semiconductors. NXP
HEF40175BT,652 Datasheet PDF : 15 Pages
First Prev 11 12 13 14 15
NXP Semiconductors
HEF40175B
Quad D-type flip-flop
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
c
y
Z
16
9
E
A
X
HE
vM A
pin 1 index
1
e
8
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (2)
e
HE
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT403-1
MO-153
L
Lp
Q
v
w
y
Z (1) θ
1
0.75 0.4
0.50 0.3
0.2 0.13
0.1
0.40
0.06
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 9. Package outline SOT403-1 (TSSOP16)
HEF40175B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 14 December 2010
© NXP B.V. 2010. All rights reserved.
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