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HDMP-1637A Ver la hoja de datos (PDF) - HP => Agilent Technologies

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HDMP-1637A Datasheet PDF : 16 Pages
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9
HDMP-1637A (Transmitter Section)
Output Jitter Characteristics (measured with equivalent parts which have TTL REFCLK input)
TA = 0°C to +70°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
Units Typ.
RJ[1]
Random Jitter at DOUT, the High Speed Electrical Data Port, specified as
ps
8
1 sigma deviation of the 50% crossing point (RMS)
DJ[1] Deterministic Jitter at DOUT, the High Speed Electrical Data Port (pk-pk)
ps
25
Note: 1. Defined by Fibre Channel Specification X3.230-1994 FC-PH Standard, Annex A, Section A.4 and tested using measurement
method shown in Figure 8.
70841B
PATTERN
GENERATOR*
0000011111
+ DATA
- DATA
125 MHz
1.25 GHz
70311A
CLOCK SOURCE
* PATTERN
GENERATOR
PROVIDES A
DIVIDE BY
10 FUNCTION.
PECL
83480A
OSCILLOSCOPE
TRIGGER
CH1 CH2
+DOUT -DOUT
HDMP-1637A
REFCLK LOOPEN
Txi[0..9]
0011111000
(STATIC K28.7)
A. BLOCK DIAGRAM OF RJ MEASUREMENT METHOD
Figure 8. Transmitter Jitter Measurement Method.
70311A
CLOCK SOURCE
DIVIDE
BY 10
CIRCUIT
(DUAL
OUTPUT)
1.25 GHz
DIVIDE
BY 2
70841B
PATTERN
GENERATOR
+K28.5, -K28.5
+ DATA
- DATA
83480A
OSCILLOSCOPE
TRIGGER
CH1 CH2
VARIABLE
DELAY
PECL
125 MHz
+DOUT -DOUTi
-DIN
+DIN
HDMP-1637A
REFCLK
ENBYTSYNC
LOOPEN
Txi[0..9] Rx[0..9]
B. BLOCK DIAGRAM OF DJ MEASUREMENT METHOD
HDMP-1637A (TRx)
Thermal and Power Temperature Characteristics
TA = 0°C to +70°C, VCC = 3.15 V to 3.45 V
Symbol
Parameter
PD,TRx[1,2]
Transceiver Power Dissipation, Outputs connected per
recommended bias terminations with idle pattern
Θjc[3]
Thermal Resistance, Junction to Case
Units
mW
°C/W
Typ.
620
Max.
900
11
Notes:
1. PD is obtained by multiplying VCC by ICC and subtracting the power dissipated outside the chip at the high speed bias resistors.
2. Specified with high speed outputs biased with 150 resistors and receiver TTL outputs driving 10 pF loads.
3. Based on independent package testing by Agilent Technologies. Θja for these devices is 56.1°C/W for the HDMP-1637A. Θja is
measured on a standard 3x3" FR4 PCB in a still air environment. To determine the actual junction temperature in a given
application, use the following: Tj = TC + (Θjc x PD), where TC is the case temperature measured on the top center of the package
and PD is the power being dissipated.

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