DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

HCTS10D/SAMPLE Ver la hoja de datos (PDF) - Intersil

Número de pieza
componentes Descripción
Fabricante
HCTS10D/SAMPLE Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20 x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100nm
4 x 4 mils
Metallization Mask Layout
HCTS10MS
HCTS10MS
A1
VCC
C1
(1)
(14)
(13)
B1 (2)
A2 (3)
B2 (4)
C2 (5)
(6)
(7)
(8)
Y2
GND
Y3
8
(12) Y1
(11) C3
(10) B3
(9) A3
Spec Number 518778

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]