HCPL-814 Ver la hoja de datos (PDF) - HP => Agilent Technologies

Número de pieza

componentes Descripción

Fabricante

HCPL-814

AC Input Phototransistor Optocoupler High Density Mounting Type

HP => Agilent Technologies 

HCPL-814-300E

4.6 ± 0.5

(0.181)

LEAD FREE

ANODE

A 814

Y WW

DATE CODE *1

6.5 ± 0.5

(0.256)

1.2 ± 0.1

(0.047)

RANK *2

2.54 ± 0.25

(0.1)

3.5 ± 0.5

(0.138)

0.35 ± 0.25

(0.014)

DIMENSIONS IN MILLIMETERS AND (INCHES)

7.62 ± 0.3

(0.3)

1.0 ± 0.25

(0.039)

10.16 ± 0.3

(0.4)

0.26

(0.010)

Solder Reflow Temperature Profile

1) One-time soldering reflow is

recommended within the

condition of temperature and

time profile shown at right.

2) When using another soldering

method such as infrared ray

lamp, the temperature may rise

partially in the mold of the

device. Keep the temperature on

the package of the device within

the condition of (1) above.

150°C

25°C

250°C

217°C

200°C

30 seconds

260°C (Peak Temperature)

60 sec

60 ~ 150 sec

90 sec

Time (sec)

60 sec

Absolute Maximum Ratings

Parameters

Symbol

Min.

Storage Temperature

TS

–55

Ambient Operating Temperature

TA

–30

Lead Solder Temperature for 10s

Tsol

(1.6 mm below seating plane)

Average Forward Current

IF

Input Power Dissipation

PI

Collector Current

IC

Collector-Emitter Voltage

VCEO

Emitter-Collector Voltage

VECO

Collector Power Dissipation

PC

Total Power Dissipation

Ptot

Isolation Voltage

Viso

(AC for 1 minute, R.H. = 40 ~ 60%)[1]

3

Max.

125

100

260

±50

70

50

35

6

150

200

5000

Units

˚C

˚C

˚C

mA

mW

mA

V

V

mW

mW

Vrms

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