HA-2548
Typical Performance Curves VS = ±15V, TA = 25oC (Continued)
AV = ±10, VIN = 300mVRMS
-20
-30
-40
-50
-60
-70
-80
-90
-100
-PSRR/CMRR
+PSRR
10
100
1K
10K 100K
1M
10M
FREQUENCY (Hz)
FIGURE 29. REJECTION RATIOS vs FREQUENCY
Die Characteristics
DIE DIMENSIONS:
85 mils x 91 mils x 19 mils
2160µm x 2320µm x 483µm
METALLIZATION:
Type: Aluminum, 1% Copper
Thickness: 16kÅ ±2kÅ
PASSIVATION:
Type: Nitride over Silox
Silox Thickness: 12kÅ ±2kÅ
Nitride Thickness: 3.5kÅ ±1kÅ
TRANSISTOR COUNT:
60
SUBSTRATE POTENTIAL
V-
NOTE: The substrate may be left floating (Insulating Die Mount) or it
may be mounted on conductor at V- potential.
Metallization Mask Layout
HA-2548
+BAL
COMP
-IN
V+
+IN
OUT
V-
-BAL
9