H11F1TVM Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
H11F1TVM Datasheet PDF : 10 Pages
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Package Dimensions
Through Hole
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.014 (0.36)
0.010 (0.25)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
0.320 (8.13)
15°
0.012 (0.30)
Surface Mount
0.350 (8.89)
0.320 (8.13)
0.390 (9.90)
0.260 (6.60) 0.332 (8.43)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.012 (0.30)
0.008 (0.20)
0.100 [2.54]
0.035 (0.88)
0.006 (0.16)
0.4" Lead Spacing
0.350 (8.89)
0.320 (8.13)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.012 (0.30)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
Note:
All dimensions are in inches (millimeters).
Recommended Pad Layout for
Surface Mount Leadform
0.070 (1.78)
0.060 (1.52)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.030 (0.76)
©2007 Fairchild Semiconductor Corporation
H11FXM Rev. 1.0.0
7
www.fairchildsemi.com
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