H11L1SM Ver la hoja de datos (PDF) - Fairchild Semiconductor

Número de pieza

componentes Descripción

Fabricante

H11L1SM

6-PIN DIP OPTOISOLATORS LOGIC OUTPUT

Fairchild Semiconductor 

6-PIN DIP

OPTOISOLATORS LOGIC OUTPUT

H11L1M

H11L2M

H11L3M

Carrier Tape Specifications

4.5 ± 0.20

0.30 ± 0.05

12.0 ± 0.1

2.0 ± 0.05

4.0 ± 0.1

21.0 ± 0.1

Ø1.5 MIN

1.75 ± 0.10

11.5 ± 1.0

9.1 ± 0.20

24.0 ± 0.3

0.1 MAX

10.1 ± 0.20

User Direction of Feed

NOTE

All dimensions are in inches (millimeters)

Reflow Profile

300

230°C, 10–30 s

250

245°C peak

200

150

Time above 183°C, 120–180 sec

100

50

Ramp up = 2–10°C/sec

0

0 0.5 1 1.5 2 2.5 3 3.5 4 4.5

Time (Minute)

Ø1.5 ± 0.1/-0

• Peak reflow temperature: 245°C (package surface temperature)

• Time of temperature higher than 183°C for 120–180 seconds

• One time soldering reflow is recommended

© 2003 Fairchild Semiconductor Corporation

Page 8 of 9

3/24/03

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