H11AV1 Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
H11AV1 Datasheet PDF : 7 Pages
| |||
H11AV1,A H11AV2,A
PACKAGE DIMENSIONS
–A–
6
4
–B–
1
3
F 4 PL
N
C
L
–T–
SEATING
PLANE
E 6 PL
K
G
M
D 6 PL
0.13 (0.005) M T A M B M
J 6 PL
0.13 (0.005) M T B M A M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.320 0.350 8.13 8.89
B 0.240 0.260 6.10 6.60
C 0.115 0.200 2.93 5.08
D 0.016 0.020 0.41 0.50
E 0.040 0.070 1.02 1.77
F 0.010 0.014 0.25 0.36
G 0.100 BSC
2.54 BSC
J 0.008 0.012 0.21 0.30
K 0.100 0.150 2.54 3.81
L
0.300 BSC
7.62 BSC
M 0_ 15_ 0 _ 15_
N 0.015 0.100 0.38 2.54
STYLE 1:
PIN 1.
2.
3.
4.
5.
6.
ANODE
CATHODE
NC
EMITTER
COLLECTOR
BASE
THRU HOLE
–A–
6
4
–B– S
1
3
F 4 PL
E 6 PL
L
H
C
–T–
G
J
SEATING
K 6 PL
PLANE
D 6 PL
0.13 (0.005) M T B M A M
0.13 (0.005) M T A M B M
SURFACE MOUNT
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.320 0.350
B 0.240 0.260
C 0.115 0.200
D 0.016 0.020
E 0.040 0.070
F 0.010 0.014
G 0.100 BSC
H 0.020 0.025
J 0.008 0.012
K 0.006 0.035
L 0.320 BSC
S 0.332 0.390
MILLIMETERS
MIN MAX
8.13 8.89
6.10 6.60
2.93 5.08
0.41 0.50
1.02 1.77
0.25 0.36
2.54 BSC
0.51 0.63
0.20 0.30
0.16 0.88
8.13 BSC
8.43 9.90
Share Link: 