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HPMX-3003-TR1 Ver la hoja de datos (PDF) - HP => Agilent Technologies

Número de pieza
componentes Descripción
Fabricante
HPMX-3003-TR1
HP
HP => Agilent Technologies HP
HPMX-3003-TR1 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
1.5 – 2.5 GHz LNA Switch PA
Technical Data
HPMX-3003
Features
• GaAs MMIC LNA-Switch-
Power Amp for 1.5 – 2.5 GHz
Transceiver Use
• LNA: 2.2 dB NF, 13 dB Ga @
1.9 GHz
• Switch: 55 dBm OIP @
1.9␣ GHz
• Power Amp: +4 dBm in,
+27.5 dBm out, 23.5 dB Gain,
35% ηadd @ 1.9 GHz
• 3 or 5 V Operation
• JEDEC Standard SSOP-28
Surface Mount Package
Plastic SSOP-28
Package Pin
Configuration
Applications
• Personal Communications
Systems (PCS)
• Cordless Telephone Systems
• 2400 MHz Wireless LANs
and ISM Band Spread
Spectrum Applications
HPMX
3003
YYWW
Functional Block Diagram
LNA out
C1
C2
PA in
(VG1)
5965-1403E
VD1
VG2
VD2
LNA in
SW1
Antenna
SW2
PA out
7-82
Description
Hewlett-Packard’s HPMX-3003
combines a Low Noise Amplifier,
GaAs MMIC switch, and 27.5 dBm
power amp in a single miniature
28 lead surface mount plastic
package. This RFIC would
typically serve as the “front end”
and power stage of a battery
operated wireless transceiver for
PCS or ISM band use. Each
section of the RFIC can also be
used independently.
The single-supply LNA makes use
of the low noise characteristics of
GaAs to create a matched, broad-
band amplifier with target perfor-
mance of 13 dB gain and 2.2 dB
noise figure. The switch provides
+55 dBm IP3 for linear operation.
The power amplifier produces up
to 820␣ mW with 35% power added
efficiency.
The HPMX-3003 is fabricated with
Hewlett-Packard’s GaAs MMIC
process, and features a nominal
0.5 micron recessed Schottky-
barrier-gate, gold metallization,
and silicon nitride passivation to
produce MMICs with superior
performance, uniformity and
reliability.

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