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FST3245MTC Ver la hoja de datos (PDF) - Fairchild Semiconductor

Número de pieza
componentes Descripción
Fabricante
FST3245MTC
Fairchild
Fairchild Semiconductor Fairchild
FST3245MTC Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Physical Dimensions
Figure 5. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4 mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
© 1997 Fairchild Semiconductor Corporation
FST3245 • Rev. 1.0.3
6
www.fairchildsemi.com

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