FSLV16211 Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
FSLV16211 Datasheet PDF : 8 Pages
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Physical Dimensions (Continued)
Dimensions are in millimeters (inches) unless otherwise noted.
Figure 7. 56-Lead Thin-Shrink Small Outline Package (TSSOP), JEDEC MO153, 6.1mm Wide
© 2003 Fairchild Semiconductor Corporation
FSLV16211 Rev. 1.0.1
7
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