DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

FOD617 Ver la hoja de datos (PDF) - Fairchild Semiconductor

Número de pieza
componentes Descripción
Fabricante
FOD617
Fairchild
Fairchild Semiconductor Fairchild
FOD617 Datasheet PDF : 12 Pages
First Prev 11 12
Lead Free recommended IR Reflow condition
Tp
Tsmax
Tsmin
Ramp-down
25°C
ts (Preheat)
Time (sec)
Soldering zon
Profile Feature
Preheat condition
(Tsmin-Tsmax / ts)
Melt soldering zone
Peak temperature (Tp)
Ramp-down rate
Pb-Sn solder assembly
100°C ~ 150°C
60 ~ 120 sec
183°C
60 ~ 120 sec
240 +0/-5°C
6°C/sec max.
Lead Free assembly
150°C ~ 200°C
60 ~120 sec
217°C
30 ~ 90 sec
260 +0/-5°C
6°C/sec max.
Recommended Wave Soldering condition
Profile Feature
Peak temperature (Tp)
For all solder assembly
Max 260°C for 10 sec
11
FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2
www.fairchildsemi.com

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]