FOD816W Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
FOD816W Datasheet PDF : 9 Pages
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Package Dimensions (Through Hole) Package Dimensions (Surface Mount)
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.130 (3.30)
0.091 (2.30)
0.150 (3.80)
0.110 (2.80)
0.110 (2.79)
0.090 (2.29)
0.020 (0.51)
TYP
0.024 (0.60)
0.016 (0.40)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.300 (7.62)
typ
0.010 (0.26)
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.051 (1.30)
0.043 (1.10)
0.024 (0.60)
0.004 (0.10)
0.110 (2.79)
0.090 (2.29)
Lead Coplanarity 0.004 (0.10) MAX
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.049 (1.25)
0.030 (0.76)
0.412 (10.46)
0.388 (9.86)
0.010 (0.26)
Package Dimensions
(0.4” Lead Spacing)
0.200 (5.10)
0.161 (4.10)
0.157 (4.00)
0.118 (3.00)
0.312 (7.92)
0.288 (7.32)
0.276 (7.00)
0.236 (6.00)
0.130 (3.30)
0.091 (2.30)
0.150 (3.80)
0.110 (2.80)
0.024 (0.60)
0.016 (0.40)
0.110 (2.79)
0.090 (2.29)
0.110 (2.80)
0.011 (1.80)
0.42 (10.66)
0.38 (9.66)
0.291 (7.40)
0.252 (6.40)
0.010 (0.26)
Footprint Dimensions
(Surface Mount)
1.5
1.3
9
2.54
NOTE
All dimensions are in inches (millimeters)
5
FOD816 Series Rev. 1.0.3
www.fairchildsemi.com
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