FOD3150 Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
FOD3150 Datasheet PDF : 19 Pages
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Package Dimensions
Through Hole
4
3
5
6
21
7
8
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
0.200 (5.08)
0.140 (3.55)
0.022 (0.56)
0.016 (0.41)
0.390 (9.91)
0.370 (9.40)
0.070 (1.78)
0.045 (1.14)
0.020 (0.51) MIN
0.154 (3.90)
0.120 (3.05)
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
15° MAX
0.300 (7.62)
TYP
0.4" Lead Spacing
4
3
21
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
5
6
7
8
0.200 (5.08)
0.140 (3.55)
0.022 (0.56)
0.016 (0.41)
0.390 (9.91)
0.370 (9.40)
0.070 (1.78)
0.045 (1.14)
0.004 (0.10) MIN
0.154 (3.90)
0.120 (3.05)
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.400 (10.16)
TYP
Surface Mount
0.390 (9.91)
0.370 (9.40)
4
3
2
1
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
5
6
7
8
0.070 (1.78)
0.045 (1.14)
0.300 (7.62)
TYP
0.020 (0.51)
MIN
0.016 (0.41)
0.008 (0.20)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
0.045 [1.14]
0.315 (8.00)
MIN
0.405 (10.30)
MAX.
8-Pin DIP – Land Pattern
0.070 (1.78)
0.060 (1.52)
0.295 (7.49)
0.415 (10.54)
0.100 (2.54)
0.030 (0.76)
Note:
All dimensions are in inches (millimeters)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©2008 Fairchild Semiconductor Corporation
FOD3150 Rev. 1.0.4
15
www.fairchildsemi.com
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