FOD3150(2010) Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
FOD3150
(Rev.:2010)
(Rev.:2010)
Fairchild Semiconductor
FOD3150 Datasheet PDF : 19 Pages
| |||
Carrier Tape Specifications
K0
t
W1
D0
P0
P2
E
A0
B0
F
W
d
User Direction of Feed
Symbol
W
t
P0
D0
E
F
P2
P
A0
B0
K0
W1
d
R
Description
Tape Width
Tape Thickness
Sprocket Hole Pitch
Sprocket Hole Diameter
Sprocket Hole Location
Pocket Location
Pocket Pitch
Pocket Dimensions
Cover Tape Width
Cover Tape Thickness
Max. Component Rotation or Tilt
Min. Bending Radius
P
D1
Dimension in mm
16.0 ± 0.3
0.30 ± 0.05
4.0 ± 0.1
1.55 ± 0.05
1.75 ± 0.10
7.5 ± 0.1
2.0 ± 0.1
12.0 ± 0.1
10.30 ±0.20
10.30 ±0.20
4.90 ±0.20
13.2 ± 0.2
0.1 max
10°
30
©2008 Fairchild Semiconductor Corporation
FOD3150 Rev. 1.0.3
17
www.fairchildsemi.com
Share Link: