FH36-15S-0.3SHW Ver la hoja de datos (PDF) - HIROSE ELECTRIC

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componentes Descripción

Fabricante

FH36-15S-0.3SHW

0.3 mm Pitch, 1.0 mm above the board Flexible Printed Circuit ZIF Connectors

HIROSE ELECTRIC 

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

FH36 Seriesq0.3 mm Pitch, 1.0 mm above the board Flexible Printed Circuit ZIF Connectors

sTemperature Profile

qUsing Lead-free Solder Paste

250

200

(ç)

150

100

150ç

MAX 250ç

200ç

230ç

50

25ç (60sec.) 90 sec. to 120 sec.

0

Start

Preheating

(60sec.)

Soldering

Time (Seconds)

HRS test condition

Solder method :Reflow, IR/hot air

Environment

:Room air

Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu

(Senju Metal Industry, Co., Ltd.'s

Part Number:M705-221CM5-32-10.5)

Test board

:Glass epoxy 25mm∞50mm∞0.8mm thick

Land dimensions :0.3mm∞0.6mm, 0.3mm∞0.8mm

Metal mask

:0.23∞0.5, 0.23∞0.65∞0.1mm thick

The temperature profiles shown are based on the above

conditions.

In individual applications the actual temperature may vary,

depending on solder paste type, volume / thickness and board

size / thickness. Consult your solder paste and equipment

manufacturer for specific recommendations.

7

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