FDG6323L Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
FDG6323L Datasheet PDF : 7 Pages
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Electrical Characteristics (TA = 25°C unless otherwise noted)
Symbol Parameter
Conditions
Min Typ Max
OFF CHARACTERISTICS
IFL
Forward Leakage Current
VIN = 8 V, VON/OFF = 0 V
1
ON CHARACTERISTICS (Note 3)
VDROP
Conduction Voltage Drop
VIN = 5 V, VON/OFF = 3.3 V, IL = 0.36 A
0.14 0.2
VIN = 2.5 V, VON/OFF = 3.3 V, IL = 0.27 A
0.15 0.2
R(ON)
Q2 - Static On-Resistance
IL
Load Current
VGS = -5 V, ID = -0.6 A
VGS = -2.5 V, ID = -0.5 A
VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V
VDROP = 0.2 V, VIN = 2.5 V, VON/OFF = 3.3 V
0.41 0.55
0.58 0.75
0.36
0.27
Notes:
1. Range of Vin can be up to 8V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed -8V.
2. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
RθJC is guaranteed by design while RθCA is determined by the user's board design.
3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
Units
µA
V
Ω
A
FDG6323L Load Switch Application
APPLICATION CIRCUIT
Q2
IN
R1
OUT
C1
Q1
ON/OFF
Co
LOAD
R2
External Component Recommendation
R1 is required to turn Q2 off.
R2 is optional for Slew Rate Control.
For Co ≤ 1uF applications:
First select R2,100 - 1KΩ, for Slew Rate control.
Then select R1 such that R1/R2 ratio maintains between 10 - 100.
FDG6323L Rev.C
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