FAN7535 Ver la hoja de datos (PDF) - Fairchild Semiconductor
Número de pieza
componentes Descripción
Fabricante
FAN7535 Datasheet PDF : 12 Pages
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Package Dimensions
24
B
7.50±0.10
10.325
15.40±0.20
13.970
A
13
14.52
10.95
9.2
1
PIN ONE
INDICATOR
0.51
0.35
0.25 M C B A
12
1.27
1.75 TYP
1.27 TYP
0.55 TYP
LAND PATTERN RECOMMENDATION
2.65 MAX
M24BREV2
(R0.10)
(R0.10)
8°
0°
0.40~1.27
(1.40)
0.20±0.10
0.75
0.25
X 45°
C
0.10 C
GAGE PLANE
0.25
SEATING PLANE
DETAIL A
SCALE: 2:1
SEE DETAIL A
0.33
0.20
SEATING PLANE
NOTES: UNLESS OTHERWISE SPECIFIED
A) THIS PACKAGE CONFORMS TO JEDEC
MS-013, ISSUE E, DATED SEPT 2005.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) LANDPATERN STANDARD: SOIC127P1030X265-24L
E) DRAWING FILENAME: MKT-M24BREV2
Figure 4. 24-Lead Small Outline Package (SOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in
any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor
representative to verify or obtain the most recent revision. Package specifications do not expand the terms of
Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
© 2007 Fairchild Semiconductor Corporation
FAN7535 Rev. 1.0.0
11
www.fairchildsemi.com
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