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FAN5099 Ver la hoja de datos (PDF) - Fairchild Semiconductor

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FAN5099 Datasheet PDF : 24 Pages
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Absolute maximum ratings apply individually only, not in combina-
tion. Unless otherwise specified, all other voltages are referenced to AGND.
Parameter
VCC to GND
Continuous
BOOT to GND
Continuous
Transient (t < 100ns, f < 500kHz)
BOOT to SW
Continuous
Transient (t < 50ns, f < 500kHz)
SW to GND
Continuous
Transient (t < 50ns, f < 500kHz)
HDRV to SW
Continuous
Transient (t < 40ns, f < 500kHz)
LDRV to PGND
Continuous
Transient (t < 40ns, f < 500kHz)
All Other Pins
Continuous
Maximum Shunt Current
Human Body Model
(Mil Std. 883E, Method 3015.7)
Electrostatic Discharge (ESD) Protection Level
Charged Device Model
(EIA/JESD22C101-A)
Min.
-0.3
-0.5
-0.5
-2.5
-0.5
-3.0
-0.5
-2.5
-0.5
-2.5
-0.3
3.5
1.8
Max.
6.0
33
35
6.0
33.0
35.0
6.0
6.0
VCC + 0.3
150
Unit
V
V
V
V
V
V
V
V
V
V
V
V
mA
kV
Thermal Information
Symbols
Parameter
Min. Typ. Max. Unit
TSTG
TL
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Vapor Phase, 60 Seconds
-65
+150
°C
+300
°C
+215
°C
Infrared, 15 Seconds
+220
°C
PD
Power Dissipation, TA = 25°C
θJC
Thermal Resistance – Junction-to-Case
θJA
Thermal Resistance – Junction-to-Ambient(1)
715
mW
37
°C/W
100
°C/W
Notes:
1. Junction-to-ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and
number of copper planes, number of vias used, diameter of vias used, available copper surface, and attached heat
sink characteristics.
© 2006 Fairchild Semiconductor Corporation
FAN5099 Rev. 1.1.5
4
www.fairchildsemi.com

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