FAN2564 Ver la hoja de datos (PDF) - Fairchild Semiconductor

Número de pieza

componentes Descripción

Fabricante

FAN2564

300mA Low VIN LDO for Digital Applications

Fairchild Semiconductor 

Layout Considerations

CIN and COUT should be placed close to the device for

optimal transient response and device behavior. A dedi-

cated ground plane is recommended for proper GND

connection.

Figure 23. Assembly Diagram

Figure 25. Bottom Layer

Figure 24. Top Layer

© 2007 Fairchild Semiconductor Corporation

FAN2564 • Rev. 1.0.2

10

www.fairchildsemi.com

Share Link: