EMIF02-SPK02F2 Ver la hoja de datos (PDF) - STMicroelectronics

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EMIF02-SPK02F2

2-line IPAD™, EMI filter and ESD protection

STMicroelectronics 

EMIF02-SPK02F2

2-line IPAD™, EMI filter and ESD protection

Features

■ Packaged in lead-free Flip Chip

■ Very low resistance: 0.35 Ω

■ High attenuation: -45 dB at 900 MHz

■ Very low PCB space consumption:

0.89 mm x 1.26 mm

■ Very thin package: 0.65 mm

■ High efficiency in ESD suppression

IEC6 1000-4-2 level 4

■ High reliability offered by monolithic integration

■ High reduction of parasitic elements through

integration and wafer level packaging

Complies with the following standards

■ IEC 61000-4-2 level 4:

– ±15 kV (air discharge)

– ±8 kV (contact discharge)

Application

■ Mobile phones

Description

The EMIF02-SPK02F2 chip is a highly integrated

device designed to suppress EMI/RFI noise for

interface line filtering.

The EMIF02-SPK02F2 flip-chip packaging means

the package size is equal to the die size. That's

why the EMIF02-SPK02F2 is a very small device.

Additionally, this filter includes ESD protection

circuitry, which prevents damage to the protected

device when subjected to ESD surges up 30 kV.

Datasheet − production data

Flip-Chip package

(5 bumps)

Figure 1. Pin configuration (bump side)

321

O1

I1

A

GND

B

O2

I2

C

Figure 2. Functional schematic

Input

Output

April 2012

This is information on a product in full production.

TM: IPAD is a trademark of STMicroelectronics

Doc ID 15035 Rev 3

1/12

www.st.com

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