EMIF02-SPK02F1 Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

EMIF02-SPK02F1

2 LINE EMI FILTER AND ESD PROTECTION

STMicroelectronics 

EMIF02-SPK01F2

Figure 14: FLIP-CHIP Tape and Reel Specification

Dot identifying Pin A1 location

4 ± 0.1

Ø 1.5 ± 0.1

ST E

xxz

yww

ST E

xxz

yww

ST E

xxz

yww

0.73 ± 0.05

All dimensions in mm

4 ± 0.1

User direction of unreeling

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These

packages have a Lead-free second level interconnect . The category of second level interconnect is

marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The

maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an

ST trademark. ECOPACK specifications are available at: www.st.com.

Table 4: Ordering Information

Ordering code

EMIF02-SPK01F2

Marking

FX

Package

Flip-Chip

Weight

2.1 mg

Base qty

5000

Delivery mode

Tape & reel (7”)

Note: More packing informations are available in the application notes

AN1235: ''Flip-Chip: Package description and recommandations for use''

AN1751: "EMI Filters: Recommendations and measurements"

Table 5: Revision History

Date

14-Oct-2004

Revision

1

First issue

Description of Changes

6/7

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