EMIF02-SPK01M6
Recommendation on PCB assembly
4
Recommendation on PCB assembly
4.1
Stencil opening design
1. General recommendation on stencil opening design
a) Stencil Opening Dimensions: L (Length), W (Width), T (Thickness).
Figure 12. Stencil opening dimensions
L
t(s) T W
roduc b) General Design Rule
P Stencil thickness (T) = 75 ~ 125 µm
lete Aspect Ratio = W-T---- ≥ 1.5
bso Aspect Area = 2----T---L-(---L-×---+--W---W-------) ≥ 0.66
O 2. Reference design
) - a) Stencil opening thickness: 100 µm
t(s b) Stencil opening for leads: Opening to footprint ratio is 90%.
ucFigure 13. Recommended stencil window position
Obsolete Prod7µm
7 µm
15 µm
236 µm
250 µm
15 µm
Footprint
Stencil window
Footprint
DocID15845 Rev 3
7/11
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