EMIF01-TV01F3(2008) Ver la hoja de datos (PDF) - STMicroelectronics

Número de pieza

componentes Descripción

Fabricante

EMIF01-TV01F3
(Rev.:2008)

Single line IPAD™, EMI filter and ESD protection

STMicroelectronics 

EMIF01-TV01F3

3

Ordering information scheme

Ordering information scheme

Figure 9. Ordering information scheme

EMIF yy - xx zz Fx

EMI Filter

Number of lines

Information

x = resistance value (Ohms)

z = capacitance value / 10 (pF)

or

2 letters = application

2 digits = version

Package

F = Flip Chip

x = 3: Lead-free, pitch = 400 µm, bump = 255 µm

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Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Figure 10. Package dimensions

400 µm ± 40

605 µm ± 55

185 µm ± 10 µm

770 µm ± 30 µm

255 µm ± 40

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