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EM55650 Ver la hoja de datos (PDF) - ELAN Microelectronics

Número de pieza
componentes Descripción
Fabricante
EM55650
EMC
ELAN Microelectronics EMC
EM55650 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
PAD DIAGRAM
Preliminary
EASY SOUND - EM55000SERIES
TINYCONTROLLER-BASEDSYNTHESIZER
VDD 7
VO 8
VSS 9
VO1 10
(0,0)
EM55200
28
OSCI
27
OSCO
26
VSS
25
TEST
24
RESET
23
P1.0
22
P1.1
11 12 13 14 15 16 17 18 19 20 21
VDD P3.3 P3.2 P3.1 P3.0 P2.3 P2.2 P2.1 P2.0 P1.3 P1.2
Chip Size : 1600 x 1700 um
For PCB layout, IC substrate must be connected to Vss.
Note : VO should be connected to VSS when not in use.
Pad No. Symbol
X
Y
1
NC
2
NC
3
NC
4
NC
5
NC
6
NC
7
VDD
-603.0
-85.1
8
VO
-603.0
-205.1
9
VSS
-603.0
-325.1
10
VO1
-603.0
-445.1
11
VDD
-597.0
-668.4
12
P3.3
-474.9
-668.4
13
P3.2
-353.5
-668.4
14
P3.1
-232.1
-668.4
15
P3.0
-110.7
-668.4
16
P2.3
12.2
-668.4
Pad No.
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
* This specification are subject to be changed without notice.
Symbol
P2.2
P2.1
P2.0
P1.3
P1.2
P1.1
P1.0
RESET
TEST
VSS
OSCO
OSCI
NC
NC
NC
NC
X
136.9
261.6
386.3
511.0
633.7
598.4
598.4
598.4
598.4
598.4
600.1
600.1
Y
-668.4
-668.4
-668.4
-668.4
-668.4
-478.3
-355.6
-232.9
-110.5
21.3
187.2
309.5
1.23.2002 11

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