EL8108 Ver la hoja de datos (PDF) - Intersil
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EL8108 Datasheet PDF : 14 Pages
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EL8108
Typical Performance Curves (Continued)
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY (4-LAYER) TEST BOARD
3.5
3.0
2.5
2.0
1.5 1.136W
1.0
0.5
SO8
+110°C/W
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 36. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - LPP EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
4.5
4.0
3.5 3.125W
3.0
QFN16
2.5
θJA = +40°C/W
2.0
1.5
1.0
0.5
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 38. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.4
1.2
1.0
781mW
0.8
0.6
0.4
θJA
=
SO8
+160°C/W
0.2
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 37. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.2
1.0
833mW
0.8
0.6
QFN16
θJA = +150°C/W
0.4
0.2
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 39. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
Applications Information
Product Description
The EL8108 is a dual current feedback operational amplifier
designed for video distribution solutions. It is a dual current
mode feedback amplifier with low distortion while drawing
moderately low supply current. It is built using Intersil’s
proprietary complimentary bipolar process and is offered in
industry standard pinouts. Due to the current feedback
architecture, the EL8108 closed-loop 3dB bandwidth is
dependent on the value of the feedback resistor. First the
desired bandwidth is selected by choosing the feedback
resistor, RF, and then the gain is set by picking the gain
resistor, RG. The curves at the beginning of the “Typical
Performance Curves” on page 4 show the effect of varying
both RF and RG. The 3dB bandwidth is somewhat
dependent on the power supply voltage.
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Ground
plane construction is highly recommended. Lead lengths
should be as short as possible, below ¼”. The power supply
pins must be well bypassed to reduce the risk of oscillation.
A 4.7µF tantalum capacitor in parallel with a 0.1µF ceramic
capacitor is adequate for each supply pin.
For good AC performance, parasitic capacitances should be
kept to a minimum, especially at the inverting input. This
implies keeping the ground plane away from this pin. Carbon
resistors are acceptable, while use of wire-wound resistors
should not be used because of their parasitic inductance.
Similarly, capacitors should be low inductance for best
performance.
10
FN7417.2
January 29, 2008
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