EL5123 Ver la hoja de datos (PDF) - Intersil

Número de pieza

componentes Descripción

Fabricante

EL5123

12MHz 4, 8, 10 & 12 Channel Rail-to-Rail Input-Output Buffers

Intersil 

EL5123, EL5223, EL5323, EL5423

Typical Performance Curves

1V/DIV

1µs/DIV

FIGURE 19. LARGE SIGNAL TRANSIENT RESPONSE

JEDEC JESD51-7 HIGH EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD, QFN EXPOSED

DIEPAD SOLDERED TO PCB PER JESD51-5

3

2.857W

2.5 2.703W

QFN32

2

QFN24

θJA=35°C/W

θJA=37°C/W

1.5

1

0.5

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

JEDEC JESD51-3 AND SEMI G42-88

(SINGLE LAYER) TEST BOARD

0.8

758mW

0.7 714mW

0.6

QFN32

0.5

QFN24

θJA=132°C/W

θJA=140°C/W

0.4

0.3

0.2

0.1

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

JEDEC JESD51-7 HIGH EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

1.4

1.333W

1.2

1.176W

1 1.111W

TSSOP24

θJA=85°C/W

0.8 870mW

0.6 TSSOP20

θJA=95°C/W

0.4

MSOP10

0.2

θJA=115°C/W

TSSOP28

θJA=75°C/W

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 22. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

JEDEC JESD51-3 LOW EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

0.9

833mW

0.8

781mW

0.7 714mW

0.6

TSSOP24

θJA=128°C/W

0.5

486mW

0.4

TSSOP28

θJA=120°C/W

MSOP10

0.3 θJA=206°C/W

0.2

TSSOP20

0.1

θJA=140°C/W

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 23. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

10

FN7176.1

November 19, 2004

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