EHP-A09 Ver la hoja de datos (PDF) - EVERLIGHT

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EHP-A09

High Power LED – 0.5W

EVERLIGHT 

EVERLIGHT ELECTRONICS CO.,LTD.

Precautions For Use

EHP-A09/SUR31-PU5/TR

1. Over-current-proof

Though EHP-A09 has conducted ESD protection mechanism, customers must not use the device in

reverse and should apply resistors for extra protection. Otherwise, slight voltage difference may cause

enormous current shift and burn out failure would happen.

2. Storage

i. Do not open the moisture proof bag before the devices are ready to use.

ii. Before the package is opened, LEDs should be stored at temperature less than 30кand humidity

less than 90%.

iii. LEDs should be used within a year.

iv. After the package is opened, LEDs should be stored at temperature less than 30кand humidity

less than 70%.

v. LEDs should be used within 168 hours (7 days) after the package is opened.

vi. If the moisture absorbent material (silicone gel) has faded away or LEDs have exceeded the

storage time, baking treatment should be implemented based on the following the conditions:

pre-curing at 60±5к for 24 hours.

3. Thermal Management

i. For maintaining the high flux output and achieving reliability, EHP-A09 series LEDs should be

mounted on a metal core printed circuit board (MCPCB) or other kinds of heat sink with proper

thermal connection to dissipate approximate 0.5W of thermal energy at 150mA operation.

ii. Special thermal designs are also recommended to take in heat dissipation management, such as

FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive,

etc.

iii. Sufficient thermal management must be implemented. Otherwise, the junction temperature of dies

might be over the limit at high current driving condition and LEDs’ lifetime might be decreases

dramatically.

iv. For further thermal management suggestions, please consult Everlight Design Guide or local

representatives for assistance.

Everlight Electronics Co., Ltd.

Device No. : DSE-A09-002

http://www.everlight.com

Prepared date: Nov. 27, 2007

Rev. 1.0

Prepared by:ʳTerry Hsu

Page: 9/10

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