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RMPA1951-102

3V PCS CDMA Power Amplifier Module

Raytheon Company 

RF Components

RMPA1951-102

3V PCS CDMA Power Amplifier Module

PRODUCT INFORMATION

Application

Information

www.raytheonrf.com

CAUTION: THIS IS AN ESD SENSITIVE DEVICE.

! Precautions to Avoid Permanent Device Damage:

– Cleanliness: Observe proper handling procedures to ensure clean devices and PCBs. Devices

should remain in their original packaging until component placement to ensure no contamination

or damage to RF, DC & ground contact areas.

– Device Cleaning: Standard board cleaning techniques should not present device problems

provided that the boards are properly dried to remove solvents or water residues.

– Static Sensitivity: Follow ESD precautions to protect against ESD damage:

• A properly grounded static-dissipative surface on which to place devices.

• Static-dissipative floor or mat.

• A properly grounded conductive wrist strap for each person to wear while handling devices.

– General Handling: Handle the package on the top with a vacuum collet or along the edges with a

sharp pair of bent tweezers. Avoiding damaging the RF, DC, & ground contacts on the package

bottom. Do not apply excessive pressure to the top of the lid.

– Device Storage: Devices are supplied in heat-sealed, moisture-barrier bags. In this condition,

devices are protected and require no special storage conditions. Once the sealed bag has been

opened, devices should be stored in a dry nitrogen environment.

! Device Usage: Raytheon recommends the following procedures prior to assembly.

– Dry-bake devices at 125°C for 24 hours minimum. Note: The shipping trays cannot withstand

125°C baking temperature.

– Assemble the dry-baked devices within 7 days of removal from the oven.

– During the 7-day period, the devices must be stored in an environment of less than 60% relative

humidity and a maximum temperature of 30°C

– If the 7-day period or the environmental conditions have been exceeded, then the dry-bake

procedure must be repeated.

! Solder Materials & Temperature Profile: Reflow soldering is the preferred method of SMT

attachment. Hand soldering is not recommended.

– Reflow Profile

• Ramp-up: During this stage the solvents are evaporated from the solder paste. Care should

be taken to prevent rapid oxidation (or paste slump) and solder bursts caused by violent

solvent out-gassing. A typical heating rate is 1- 2°C/sec.

• Pre-heat/soak: The soak temperature stage serves two purposes; the flux is activated and

the board and devices achieve a uniform temperature. The recommended soak condition is:

120-150 seconds at 150°C.

• Reflow Zone: If the temperature is too high, then devices may be damaged by mechanical

stress due to thermal mismatch or there may be problems due to excessive solder oxidation.

Excessive time at temperature can enhance the formation of inter-metallic compounds at the

lead/board interface and may lead to early mechanical failure of the joint. Reflow must occur

prior to the flux being completely driven off. The duration of peak reflow temperature should

not exceed 10 seconds. Maximum soldering temperatures should be in the range 215-220°C,

with a maximum limit of 225°C.

• Cooling Zone: Steep thermal gradients may give rise to excessive thermal shock. However,

rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The

illustration below indicates the recommended soldering profile.

! Solder Joint Characteristics: Proper operation of this device depends on a reliable void-free

attachment of the heatsink to the PWB. The solder joint should be 95% void-free and be a consistent

thickness.

! Rework Considerations: Rework of a device attached to a board is limited to reflow of the solder

with a heat gun. The device should not be subjected to more than 225°C and reflow solder in the

molten state for more than 5 seconds. No more than 2 rework operations should be performed.

Specifications are based on most current or latest revision.

Revised February 6, 2003

Page 4

Raytheon RF Components

362 Lowell Street

Andover, MA 01810

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