TQ5122 Ver la hoja de datos (PDF) - TriQuint Semiconductor
Número de pieza
componentes Descripción
Fabricante
TQ5122 Datasheet PDF : 9 Pages
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Package Type: Power QSOP-16 Plastic Package
D
NOTE A
TQ5122
Data Sheet
b
A
e
A1
E
E1
NOTE B
c
L
θ
DESIGNATION
A
A1
b
c
D
e
E
E1
L
θ
DESCRIPTION
OVERALL HEIGHT
STANDOFF
LEAD WIDTH
LEAD THICKNESS
PACKAGE LENGTH
LEAD PITCH
LEAD TIP SPAN
PACKAGE WIDTH
FOOT LENGTH
FOOT ANGLE
ENGLISH
0.064 +/-.005 in
0.007 +/-.003 in
0.010 +/-.002 in
0.085 +/-.015 in
0.193 +/-.004 in
0.025 BSC
0.236 +/-.008 in
0.154 +/-.003 in
0.033 +/-.017 in
4 +/-4 DEG
METRIC
1.63 +/-.13 mm
0.18 +/-.08 mm
0.25 +/-.05 mm
2.16 +/-.38 mm
4.90 +/-.10 mm
0.635 BSC
5.99 +/-.20 mm
3.91 +/-.08 mm
0.84 +/-.43 mm
4 +/-4 DEG
NOTE
C
C
C
C
A, C
C
B, C
C
NOTES:
A. The D dimension does not include mold flashing and mismatch. Mold flashing and mismatch shall not exceed .006 in (.15 mm) per
side.
B. The E1 dimension does not include mold flashing and mismatch. Mold flashing and mismatch shall not exceed .010 in (.25 mm)
per side.
C. Primary units are English inches. The metric equivalents are subject to rounding error.
Additional Information
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Email: info_wireless@tqs.com
Tel: (503) 615-9000
Fax: (503) 615-8900
For technical questions and additional information on specific applications:
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The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of
this information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or
licenses to any of the circuits described herein are implied or granted to any third party.
TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems.
Copyright © 1999 TriQuint Semiconductor, Inc. All rights reserved.
Revision D, August 19, 1999
For additional information and latest specifications, see our website: www.triquint.com
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