RF2352 Ver la hoja de datos (PDF) - RF Micro Devices

Número de pieza

componentes Descripción

Fabricante

RF2352

3V CDMA DRIVER AMPLIFIER

RF Micro Devices 

RF2352

Preliminary

Application Schematic

VCC 1 nF

10 nH

4 pF

50 Ω µstrip

RF OUT

1 16 15 14 13

VCC

22 nF

RF IN

2

12

1 nF

3

11

4

VCC

1500 Ω

50 Ω µstrip

4

10

1 nF

56789

1 nF

MODE SELECT

Package base serves as die flag ground. The vias

connecting the backside of the board should be

large in diameter to allow for easier soldering.

Evaluation Board Schematic

(Download Bill of Materials from www.rfmd.com.)

VCC

J1

RF IN

VREF

50 Ω µstrip

C1

22 nF

R1

1500 Ω

C2

1 nF

C3

1 nF

1 16 15 14 13

2

12

3

11

L1

10 nH

C6

1 nF

C5

4 pF

C4

1 nF

50 Ω µstrip

4

10

56789

2352400-

50 Ω µstrip

J2

RF OUT

VCC

PD R2*

R4*

0Ω

50 Ω µstrip

0Ω

* R2, R3 and R4 form a "Tee" attenuator network which

determines the gain in the bypass mode. Evaluation

boards are shipped with R2 and R4 as 0 Ω jumpers, and

R3 omitted. This configuration provides the maximum

gain (about -4 dB) available in bypass mode.

Package base serves as die flag ground. The vias

connecting the backside of the board should be large in

diameter to allow for easier soldering.

R3*

*

OMIT

P1

1

PD

2 GND

3 VREF

CON3

P2

1

NC

2 GND

3 VCC

CON3

4-180

Rev A4 010720

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