DS1644 Ver la hoja de datos (PDF) - Maxim Integrated

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componentes Descripción

Fabricante

DS1644

Nonvolatile Timekeeping RAM

Maxim Integrated 

DS1644/DS1644P

NOTES:

1. All voltages are referenced to ground.

2. Typical values are at 25C and nominal supplies.

3. Outputs are open.

4. Data retention time is at 25C and is calculated from the date code on the device package. The date

code XXYY is the year followed by the week of the year in which the device was manufactured. For

example, 9225 would mean the 25th week of 1992.

5. tAH1, tDH1 are measured from WE going high.

6. tAH2, tDH2 are measured from CE going high.

7. Real-Time Clock Modules (DIP) can be successfully processed through conventional wave-soldering

techniques as long as temperatures as long as temperature exposure to the lithium energy source

contained within does not exceed +85C. Post solder cleaning with water washing techniques is

acceptable, provided that ultrasonic vibration is not used.

In addition, for the PowerCap version:

a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through

solder reflow oriented with the label side up (“live - bug”).

b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than

3 (three) seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To

remove the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick

to remove solder.

PACKAGE INFORMATION

For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note

that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a

different suffix character, but the drawing pertains to the package regardless of RoHS status.

PACKAGE TYPE

PACKAGE CODE

DOCUMENT NO.

28 EDIP

MDF28+3

21-0245

34 PWRCP

PC2+2

21-0246

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