DG3015 Ver la hoja de datos (PDF) - Vishay Semiconductors
Número de pieza
componentes Descripción
Fabricante
DG3015 Datasheet PDF : 9 Pages
| |||
Product is End of Life
DG3015
Vishay Siliconix
PACKAGE OUTLINE
MICRO FOOT: 16 BUMP (4 x 4, 0.5 mm PITCH, 0.238 mm BUMP HEIGHT)
16 X Ø 0.150 ∼ 0.229
Note b
Solder Mask Ø ∼ Pad Diameter + 0.1
Silicon
0.5
0.5
Recommended Land Pattern
Index-Bump A1
Note c
A
A2
A1
b Diameter
4
3
2
1
e
e
XXX
e
3015
S
Top Side (Die Back)
S
e
e
e
D
Notes (Unless Otherwise Specified):
a. Bump is Lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; back-lapped, no coating. Shown is not actual marking; sample only.
Bump
Note a
A
B
E
C
D
Dim.
Millimetersa
Min.
Max.
Inches
Min.
Max.
A
0.688
0.753
0.0271
0.0296
A1
0.218
0.258
0.0086
0.0102
A2
0.470
0.495
0.0185
0.0195
b
0.306
0.346
0.0120
0.0136
D
1.980
2.020
0.0780
0.0795
E
1.980
2.020
0.0780
0.0795
e
0.5 BASIC
0.0197 BASIC
S
0.230
0.270
0.0091
0.0106
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?72962.
Document Number: 72962
www.vishay.com
S-70853-Rev. C, 30-Apr-07
7
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Share Link: 