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CY7C1351G Ver la hoja de datos (PDF) - Cypress Semiconductor

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CY7C1351G Datasheet PDF : 14 Pages
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CY7C1351G
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Supply Voltage on VDD Relative to GND........ –0.5V to +4.6V
Supply Voltage on VDDQ Relative to GND ...... –0.5V to +VDD
DC Voltage Applied to Outputs
in tri-state ............................................ –0.5V to VDDQ + 0.5V
DC Input Voltage ................................... –0.5V to VDD + 0.5V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage.......................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current.................................................... > 200 mA
Operating Range
Ambient
Range Temperature (TA)
VDD
VDDQ
Commercial 0°C to +70°C 3.3V –5%/+10% 2.5V –5%
Industrial 40°C to +85°C
to VDD
Electrical Characteristics Over the Operating Range [10,11]
Parameter
Description
Test Conditions
VDD
VDDQ
Power Supply Voltage
I/O Supply Voltage
for 3.3V I/O
for 2.5V I/O
VOH
Output HIGH Voltage
for 3.3V I/O, IOH = -4.0 mA
for 2.5V I/O, IOH = -1.0 mA
VOL
Output LOW Voltage
for 3.3V I/O, IOL= 8.0 mA
for 2.5V I/O, IOL= 1.0 mA
VIH
Input HIGH Voltage
for 3.3V I/O
Input HIGH Voltage
for 2.5V I/O
VIL
Input LOW Voltage[10]
for 3.3V I/O
Input LOW Voltage[10]
for 2.5V I/O
IX
Input Leakage Current
GND < VI < VDDQ
except ZZ and MODE
Input Current of MODE Input = VSS
Input = VDD
Input Current of ZZ
Input = VSS
Input = VDD
IOZ
Output Leakage Current GND < VI < VDDQ, Output Disabled
IDD
VDD Operating Supply
VDD = Max., IOUT = 0 mA,
7.5-ns cycle, 133 MHz
Current
f = fMAX = 1/tCYC
10-ns cycle, 100 MHz
ISB1
Automatic CE Power-down VDD = Max, Device Deselected, 7.5-ns cycle, 133 MHz
Current—TTL Inputs
VIN > VIH or VIN VIL, f = fMAX,
inputs switching
10-ns cycle, 100 MHz
ISB2
Automatic CE Power-down VDD = Max, Device Deselected, All speeds
Current—CMOS Inputs VIN > VDD – 0.3V or VIN < 0.3V,
f = 0, inputs static
ISB3
Automatic CE Power-down VDD = Max, Device Deselected, 7.5-ns cycle, 133 MHz
Current—CMOS Inputs
VIN > VDDQ – 0.3V or VIN < 0.3V,
f = fMAX, inputs switching
10-ns cycle, 100 MHz
ISB4
Automatic CE Power-down VDD = Max, Device Deselected, All speeds
Current—TTL Inputs
VIN > VIH or V IN < VIL, f = 0,
inputs static
Min.
3.135
3.135
2.375
2.4
2.0
2.0
1.7
–0.3
–0.3
5
–30
–5
–5
Max. Unit
3.6
V
VDD
V
2.625 V
V
V
0.4
V
0.4
V
VDD + 0.3V V
VDD + 0.3V V
0.8
V
0.7
V
5
µA
µA
5
µA
µA
30
µA
5
µA
225 mA
205 mA
90
mA
80
mA
40
mA
75
mA
65
mA
45
mA
Notes:
10. Overshoot: VIH(AC) < VDD +1.5V (Pulse width less than tCYC/2), undershoot: VIL(AC)> –2V (Pulse width less than tCYC/2).
11. TPower-up: Assumes a linear ramp from 0V to VDD (min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.
Document #: 38-05513 Rev. *D
Page 7 of 14
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