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CY7C1347F Datasheet PDF : 19 Pages
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CY7C1347F
Electrical Characteristics Over the Operating Range (continued)[8, 9]
Parameter
Description
Test Conditions
ISB3
Automatic CE
Max. VDD, Device Deselected, or 4-ns cycle, 250 MHz
Power-down
VIN ≤ 0.3V or VIN > VDDQ – 0.3V 4.4-ns cycle, 225 MHz
Current—CMOS Inputs f = fMAX = 1/tCYC
5-ns cycle, 200 MHz
6-ns cycle, 166 MHz
7.5-ns cycle, 133 MHz
ISB4
Automatic CE
Max. VDD, Device Deselected,
Power-down
VIN ≥ VIH or VIN ≤ VIL, f = 0
Current—TTL Inputs
Shaded areas contain advance information.
Min.
Max.
105
100
95
85
75
45
Capacitance[10]
Parameter
Description
Test Conditions
TQFP
Package
BGA
Package
fBGA
Package
CIN
Input Capacitance
TA = 25°C, f = 1
5
MHz,
CCLK
Clock Input Capacitance VDD = 3.3V.
5
CI/O
Input/Output Capacitance VDDQ = 3.3V
5
5
5
5
5
7
7
Unit
mA
mA
mA
mA
mA
mA
Unit
pF
pF
pF
AC Test Loads and Waveforms
3.3V I/O Test Load
OUTPUT
Z0 = 50Ω
3.3V
OUTPUT
RL = 50Ω
5 pF
VL = 1.5V
(a)
2.5V I/O Test Load
INCLUDING
JIG AND
SCOPE
R = 317Ω
R = 351Ω
(b)
VDDQ
GND
ALL INPUT PULSES
10%
90%
≤ 1ns
90%
10%
≤ 1ns
(c)
OUTPUT
2.5V
Z0 = 50Ω
OUTPUT
RL = 50Ω
5 pF
VL = 1.25V
(a)
INCLUDING
JIG AND
SCOPE
R = 1667Ω
R =1538Ω
VDDQ
GND
ALL INPUT PULSES
10%
90%
≤ 1ns
90%
10%
≤ 1ns
(b)
(c)
Thermal Resistance[10]
Parameter
Description
Test Conditions
TQFP
Package
QJA
Thermal Resistance Test conditions follow standard
41.83
(Junction to Ambient) test methods and procedures for
QJC
Thermal Resistance measuring thermal impedance,
(Junction to Case)
per EIA / JESD51.
9.99
Note:
10. Tested initially and after any design or process changes that may affect these parameters.
BGA
Package
47.63
11.71
fBGA
Package
20.3
4.6
Unit
°C/W
°C/W
Document #: 38-05213 Rev. *D
Page 9 of 19
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