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CY14B101Q Ver la hoja de datos (PDF) - Cypress Semiconductor

Número de pieza
componentes Descripción
Fabricante
CY14B101Q
Cypress
Cypress Semiconductor Cypress
CY14B101Q Datasheet PDF : 34 Pages
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CY14C101Q
CY14B101Q, CY14E101Q
Figure 6. SPI Mode 3
CS
SCK
012 34567
SI
7 654321 0
MSB
LSB
SPI Operating Features
Power-Up
Power-up is defined as the condition when the power supply is
turned on and VCC crosses Vswitch voltage. During this time, the
CS must be allowed to follow the VCC voltage. Therefore, CS
must be connected to VCC through a suitable pull up resistor. As
a built in safety feature, CS is both edge sensitive and level
sensitive. After power-up, the device is not selected until a falling
edge is detected on CS. This ensures that CS must have been
HIGH, before going Low to start the first operation.
As described earlier, nvSRAM performs a Power-Up RECALL
operation after power-up and therefore, all memory accesses are
disabled for tFA duration after power-up. The HSB pin can be
probed to check the Ready/Busy status of nvSRAM after power-
up.
Power On Reset
A Power On Reset (POR) circuit is included to prevent
inadvertent writes. At power-up, the device does not respond to
any instruction until the VCC reaches the POR threshold voltage
(VSWITCH). After VCC transitions the POR threshold, the device
is internally reset and performs an power-Up RECALL operation.
During power-Up RECALL all device accesses are inhibited. The
device is in the following state after POR:
â–  Deselected (after power-up, a falling edge is required on CS
before any instructions are started).
â–  Standby power mode
â–  Not in the HOLD condition
â–  Status Register state:
â Write Enable (WEN) bit is reset to ‘0’.
â WPEN, BP1, BP0 unchanged from previous STORE
operation
The WPEN, BP1, and BP0 bits of the Status Register are
nonvolatile bits and remain unchanged from the previous
STORE operation.
Before selecting and issuing instructions to the memory, a valid
and stable VCC voltage must be applied. This voltage must
remain valid until the end of the instruction transmission.
Power-Down
At power-down (continuous decay of VCC), when VCC drops from
the normal operating voltage and below the VSWITCH threshold
voltage, the device stops responding to any instruction sent to it.
If a write cycle is in progress and the last data bit D0 has been
received when the power goes down, it is allowed tDELAY time to
complete the write. After this, all memory accesses are inhibited
and a conditional AutoStore operation is performed (AutoStore is
not performed if no writes have happened since the last RECALL
cycle). This feature prevents inadvertent writes to nvSRAM from
happening during power-down.
However, to completely avoid the possibility of inadvertent writes
during power-down, ensure that the device is deselected and is
in standby power mode, and the CS follows the voltage applied
on VCC.
Active Power and Standby Power Modes
When CS is LOW, the device is selected and is in the active
power mode. The device consumes ICC current, as specified in
DC Electrical Characteristics on page 21. When CS is HIGH, the
device is deselected and the device goes into the standby power
mode after tSB time if a STORE or RECALL cycle is not in
progress. If a STORE/RECALL cycle is in progress, the device
goes into the standby power mode after the STORE or RECALL
cycle is completed. In the standby power mode, the current
drawn by the device drops to ISB.
Document #: 001-54393 Rev. *F
Page 8 of 34

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